The CS-FLUX is a no-clean solder auxiliary highly liquid, lead-free specially designed for repairing BGA components (reballing and reflow) and other SMD components in laptop, gaming consoles etc.
Key features in CS-FLUX:
The CS-FLUX when heated to approximately 150 degrees is converted into liquid and completely covers the micro gap between component BGA and PCB. In this manner all the "balls" of the component are covered with CS-FLUX and during reflow or removal of the fitting all the pad of the component and the PCB are not destroyed.
The CS-FLUX is no clean flux but if necessary can be easily cleaned with alcohol. Causes no corrosion to the PCB and components.
Thanks to the highly fluid nature of the minimum quantity of CS-FLUX is required for each repair resulting in much cleaner interface. Even to CS-FLUX contains lead.
The CS-FLUX is very sticky and designed to hold the balls of the component into the stencil during reballing process.
