● Microprocessor-controlled equipment.
● Direct PCB temperature measurement, improves accuracy and lessens damage or distortion.
● Five (5) temperature and time control points with automatic slope adjustment. Configurable to suit different solder paste and circuit boards.
● Two (2) default profiles suitable with most common solder paste specifications.
● Quick and easy resetting of control points for precise tuning of reflow profiles.
● Built-in safety feature of industry standard 0.01°C/s to 3°C/s rising slope.
● Fully digital panel controls and read-out of time and temperature for monitoring and ease of use.
● Highly compatible with lead-free applications.
SPECIFICATIONS
MAIN STATION
Power Input
Available in 110V / 220V
Station Dimensions
360 (l) x 385 (w) x 190 (h) mm
Weight
3.5 Kgs.
Heating Power
1100W
Temperature Range
100°C - 250°C
Heating Element Type
Infrared
Valid Solder Area
210 mm x 190 mm
Standard reflow time
4 mins — 8 mins
Rising slope
0.01℃/s to 3 ℃/s
