Product Description
LED and BGA Rework Station ZM R720
The LED and BGA Rework Station ZM R720 is suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired. Suitable for LED lamp beads of tape packaging and bulk materials, Also any BGA and components which are difficult to repair. The LED and BGA Rework Station ZM R720 uses high solution optical alignment system, accurate LED components positioning, ensure precise mounting. Optical alignment is controlled electrically, and can rotate automatically. A mounting head built-in pressure testing device is fitted to protect the PCB. The LED and BGA Rework Station ZM R720 comes with a built-in infrared laser positioning for fast positioning of the PCB. The ZM R720 is fitted with HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running. The system adopts an up and down alignment for top and bottom heater. Heating for appointed local zone prevents PCB to turning yellow. Bottom heater up and down can be manually adjusted for heating height real time. LED and BGA Rework Station ZM R720 has ceramics infrared radiator for IR heater, heating stably and uniformly which preserves the life. Human-machine interface has multiple operation mode and permission, soldering, desoldering and mounting manually for easy operation. The LED and BGA Rework Station ZM R720 has a high resolution touch screen, which is up to 800*600 pixels. A joystick control for alignment system is used and so no need for setting complicated parameters. A Delta double ball bearing flow fan for air supply is used and so no need for an external air source. Adopts DCCE 6 channel module for temperature control system, automatic PID adjustment. Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC, which will close output channel and display fault condition.
Technical Parameters
Total Power – Max 5300W
Power – AC 220V±10% 50/60 Hz
Top heater power – 1200W
Bottom heater power – 1200W
IR power – 2700W
Hot air temp – 400℃ (Max)
Preheating temp – 400℃（Max）
Positioning – V-groove +laser positioning+ universal fixture
PCB size – Max 410×370 mm
Preheating size – 370mm×270mm
Chip type – BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads
Chip size – Max 80×80mm Min 2×2 mm
Dimensions – L640×W630×H900 mm
Temperature sensor – 1Pc
Net weight – 70k
Colour – White
