Main features:
Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
Temperature parameters protected by limits of authority, for avoiding error settings.
Ten segments of temperature control process, suitable for all kinds of BGA Rework.
Unlimited storage of the temperature profile, just need press one key to use the profile.
Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
Desoldering and soldering automatically, No need the manual adjustment.
Hot air flow can be adjustable to meet the demand of any chips.
USB Connection driver-free, PC control.
The bottom hot air lifting control available in the front panel, to adjust at any time.
Main technical parameter
Power supply AC 220V±10 50/60 Hz
Top hot air heater power 800 W
Bottom hot air heater power 800 W
IR preheating power 2400 W
Hot air heating temp 400℃(Max)
Bottom preheating size 400mm×300mm
Max available PCB size 400mm×380mm
Available chip size 2×2mm--60×60mm
Dimensions L520×W520×H550
Communication port USB
External temperature port 3pcs
Net weight 25kg
Color Milk White
CE idendificated,ensure the product value and 1 year warranty,(offer free parts within 1 year).
