Flux oil paste in shape RMA-223.
Chemical Characteristics
State Viscous
Colour Yellow
Odour Mildly, sweet odor
PH (5%aq. sol.) 3 (35% sol. of flux)
IPC-and EN-Classification RE/L0
JV-F000
Flash Point 158°C
Solubility in water Insoluble
Auto-ignition point > 370°C
Specific Gravity 1.032g/ml
Viscosity at 20°C ± 210.000 cPs
(Brookfield 5 RPM, TF spindle)
Solder Flux was specifically developed for SMT-repairs, whereas it is also recommended for manual hand soldering applications. The main components of this soldering flux are modified resins in combination with an activators system. This basis guarantees excellent soldering results.
The difficult soldering in place of SMD-components becomes an easy and fast operation due to our solder-flux. Solder-Flux is a gel-like flux, recommended for SOPs, QFPs, PLCCs etc. and for the use of hot air or soldering iron. For lab samples, small series, model-making, or for the professional use of SMD-components with hot air pistons, hot plate, soldering iron etc. They are conveniently stored in syringes and therefore quarantee a clean and accurate usage. This soldering paste - solder flux gel can be used directly from the cartridge, no mixing is needed.
By means of soldering a non-detachable, bonded and electrically conductive connection is established. A fusible metal alloy serves as connection material. A connection of metallic components is established. The metal surfaces have to be blank and therefore devoid of oxides and soilings so that the difussion process takes place.
Solderings are almost exclusively with air exposure carried out. Even during the heating of the solder joint, the oxygen proportion in the air favours the oxidation of the surfaces. For this reason a reliable and effective soldering can be problematic.
In such cases, a so-called flux is applied, before the soldering process. The flux reduces (deoxidizes) the surface when soldering and is meant to prevent a new oxide forming before and during the soldering process, that otherwise would strongly diminuish the flow- and wetting properties, and furthermore is intended to reduce foreign particle inclusions . One further effect is the surface tension reduction of the liquid solder.
