Σύστημα με βάση επανακατασκευής σφαιριδίων κόλησης BGA Re Balling System 910

Features:
- sure fixing of the chip for the reballing
- Delivery with stencils
- sure and clean reballing with a low cost expenditure.
Re-balling Base
- Solder Flux
- Balls
- Stencils (D-IN-810)
- Stencils (D-FW-801BA)
- Stencils (D-C-693A)
- Mini Spatula
- Allen Key(2mm & 3mm)
- Manual

• BGA Tools & Parts